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? semiconductor components industries, llc, 2016 1 publication order number: november 2016 - rev. 1 moc3071m / d moc3071m, moc3072m 6 - pin dip random - phase triac driver optocoupler (800 volt peak) the moc3071m and moc3072m consist of a gaas infrared emitting diode optically coupled to a non - zero - crossing silicon bilateral ac switch (triac). these devices isolate low voltage logic from 240 v ac lines to provide random phase control of high current triacs or thyristors. these devices fea ture greatly enhanced static dv/dt capability to ensure stable switching performance of inductive loads. features ? excellent i ft stability ir emitting diode has low degradation ? 800 v peak blocking voltage ? safety and regulatory approvals C ul1577, 4,170 vac r ms for 1 minute C din en/iec60747 - 5 - 5 (pending approval) typical applications ? solenoid/valve controls ? lamp ballasts ? static ac power switch ? interfacing microprocessors to 240 v ac peripherals ? solid state relay ? incandescent lamp dimmers ? temperature controls ? motor controls www.onsemi.com mdip 6l white marking diagram 1 . f = fairchild logo 2 . moc3071 =specific device code 3 . v =din en/iec60747 - 5 - 5 option 4 . x = one - digit year code 5 . yy =two - digit work week 6 . q =assembly package code pin connections ordering information see detailed ordering and shipping information page 9 of this data sheet .
moc3071m, moc3072m www. onsemi.com 2 safety and insulations ratings as per din en/iec 60747 - 5 - 5 (pending approval) , this optocoupler is suitable for safe electrical insulation only within the safety limit data. compliance with the safety ratings shall be ensured by means of protective circuits. parameter characteristics installation classifications per din vde 0110/1.89 table 1, for rated mains voltage < 150 v rms i C C symbol parameter value unit v pr input - to - output test voltage, method a, v iorm x 1.6 = v pr , type and sample test with t m = 10 s, partial discharge < 5 pc 1360 v peak input - to - output test voltage, method b, v iorm x 1.875 = v pr , 100% production test with t m = 1 s, partial discharge < 5 pc 1594 v peak v iorm maximum working insulation voltage 850 v peak v iotm highest allowable over - voltage 6000 v peak external creepage 7 mm external clearance 7 mm external clearance (for option tv, 0.4" lead spacing) 10 mm dti distance through insulation (insulation thickness) 0.5 mm r io insulation resistance at t s , v io = 500 v > 10 9
moc3071m, moc3072m www. onsemi.com 3 maximum ratings (note 1 ) t a = 25c unless otherwise specified. symbol parameters value unit total device t stg storage temperature - 40 to +150 c t opr operating temperature - 40 to +85 c t j junction temperature range - 40 to +100 c t sol lead solder temperature 260 for 10 seconds c p d total device power dissipation at 25c ambient 330 mw derate above 25c 4.4 mw/c emitter i f continuous forward current 60 ma v r reverse voltage 3 v p d total power dissipation at 25c ambient 100 mw derate above 25c 1.33 mw/c detector v drm off - state output terminal voltage 800 v i tsm peak non - repetitive surge current (single cycle 60 hz sine wave) 1 a p d total power dissipation at 25c ambient 300 mw derate above 25c 4 mw/c 1. stresses exceeding those listed in the maximum ratings table may damage the device. if any of these limits are exceeded, devi ce functionality should not be assumed, damage may occur and reliability may be affected.
moc3071m, moc3072m www. onsemi.com 4 symbol parameters test conditions min. typ. max. unit emitter v f input forward voltage i f = 10 ma 1.18 1.50 v i r reverse leakage current v r = 3 v 0.05 100 a detector i drm peak blocking current, either direction v drm = 800 v, i f = 0 (note 2 ) 10 200 na v tm peak on - state voltage, either direction i tm = 100 ma peak, i f = 0 2. 2 2.5 v dv/dt critical rate of rise of off - state voltage i f = 0 , v drm = 800 v) 1000 v/s transfer characteristics symbol dc characteristics test conditions device min. typ. max. unit i ft led trigger current, either direction main terminal voltage = 3 v (note 3 ) moc3071m 15 ma moc3072m 10 i h holding current, either direction all 540 a isolation characteri stics symbol characteristic test conditions min. typ. max. unit v iso input - output isolation voltag e (note 4 ) f = 60 hz, t = 1 minute 4170 v ac rms r iso isolation resistance v i - o = 500 v dc 10 11 test volt age must be applied within dv/dt rating. 3. all devices are guaranteed to trigger at an i f value less than or equal to max i ft . therefore, the recommended operating i f lies between maximum i f t (15 ma for moc3071m, 10 ma for moc3072m) and absolute maximum i f (60 ma). 4. isolation voltage, v iso , is an internal device dielectric breakdown rating. for this test, pins 1 and 2 are common, and pins 4, 5 and 6 are common. electrical characteristics t a = 25c unless otherwise specified. individual component characteristics
moc3071m, moc3072m www. onsemi.com 5 typical characteristics figure 1 . led forward voltage vs. forward current figure 2 . on - state characteristics figure 3 . led trigger current vs. ambient temperature figure 4 . led trigger current vs. led pulse width figure 5 . holding current vs. ambient temperature figure 6 . leakage current vs. ambient temperature 1 10 100 0 5 10 15 pw - led trigger pulse width (s) i ft (normalized) = i ft ( pw ) / i ft ( pw=100s ) normalized to pw = 100s -40 -20 0 20 40 60 80 100 0 1 2 3 4 t a - ambient temperature (c) i h (normalized) = i h ( t a ) / i h ( t a =25c ) normalized to t a = 25c -40 -20 0 20 40 60 80 100 0.1 1 10 100 1000 10000 t a - ambient temperature (c) i drm - leakage current (na) v drm = 800 v -3 -2 -1 0 1 2 3 -400 -300 -200 -100 0 100 200 300 400 v tm - on-state voltage (v) i tm - on-state current (ma) 1 10 100 0.9 1.0 1.1 1.2 1.3 1.4 1.5 1.6 1.7 t a = 100 c t a = 25 c t a = -40 c i f - led forward current (ma) v f - forward voltage (v) -40 -20 0 20 40 60 80 100 0.6 0.8 1.0 1.2 1.4 t a - ambient temperature (c) i ft (normalized) = i ft ( t a ) / i ft ( t a =25c ) normalized to t a = 25c
moc3071m, moc3072m www. onsemi.com 6 applications information basic triac driver circuit the random phase triac drivers moc3071m and moc3072m can allow snubberless operations in applications where load is resistive and the external generated noise in the ac line is below its guaranteed dv/dt withstand capability. for these applications, a snub ber circuit is not necessary when a noise insensitive power triac is used. figure 7 shows the circuit diagram. the triac driver is directly connected t o the triac main terminal 2 and a series resistor r which limits the current to the triac driver. current limiting resistor r must have a minimum value which restricts the current into the driver to maximum 1 a. the power dissipation of this current limit ing resistor and the triac driver is very small because the power triac carries the load current as soon as the current through driver and current limiting resistor reaches the trigger current of the power triac. the switching transition times for the driv er is only one micro second and for power triacs typical four micro seconds. triac driver circuit for noisy environments when the transient rate of rise and amplitude are expected to exceed the power triacs and triac drivers maximum ratings a snubber circ uit as shown in figure 8 is recommended. fast transients are slowed by the r - c snubber and excessive amplitudes are clipped by the metal oxide varisto r mov. triac driver circuit for extremely noisy environments as specified in the noise standards ieee472 and iec255 - 4. industrial control applications do specify a maximum transient noise dv/dt and peak voltage which is super - imposed onto the ac line vol tage. in order to pass this environment noise test a modified snubber network as shown in figure 9 is recommended. led trigger current versus tempera ture recommended operating led control current i f lies between the guaranteed i ft and absolute maximum i f . figure 3 shows the increase of the trigger current when the device is expected to operate at an ambient temperature below 25c. multiply the datasheet guaranteed i ft with the normalized i ft shown on t his graph and an allowance for led degradation over time. example: i ft = 10 ma, led degradation factor = 20% i f at - 40c = 10 ma x 1.25 x 120% = 15 ma led trigger current v s . pulse width random phase triac drivers are designed to be phase controllable. they may be triggered at any phase angle within the ac sine wave. phase control may be accomplished by an ac line zero cross detector and a variable pulse delay generator which is synchronized to the zero cross detector. the same task can be accomplished b y a microprocessor which is synchronized to the ac zero crossing. the phase controlled trigger current may be a very short pulse which saves energy delivered to the input led. led trigger pulse currents shorter than 100 s must have increased amplitude as shown on figure 4 . this graph shows the dependency of the trigger current i ft versus the pulse width. i ft in this graph is normalized in respect to the minimum specified i ft for static condition, which is specified in the device characteristic. the normalized i ft has to be multiplied with the devices guaranteed static trigger current. example: i ft = 10 ma, trigger pw = 4 s i f (pulsed) = 10 ma x 3 = 30 ma minimum led off time in phase control applications in phase control applications, one intends to be able to control each ac sine half wave from 0 to 180. turn on at 0 means full power and turn on at 180 means zero power. this is not quite possible in reality because triac driver and triac have a fixed turn on time when activated at zero degrees. at a phase control angle close to 180the drivers turn on pulse at the trailing edge of the ac sine wave must be limited to end 200 s before ac zero cross as shown in figure 10 . this assures that the triac driver has time to switch off. shorter times may cause loss of control at the following half cycle. static dv/dt critical rate of rise of off - state voltage or s tatic dv/dt is a triac characteristic that rates its ability to prevent false triggering in the event of fast rising line voltage transients when it is in the off - state. when driving a discrete power triac, the triac driver optocoupler switches back to off - state once the power triac is triggered. however, during the commutation of the power triac in application where the load is inductive, both triacs are subjected to fast rising voltages. the static dv/dt rating of the triac driver optocoupler and the comm utating dv/dt rating of the power triac must be taken into consideration in snubber circuit design to prevent false triggering and commutation failure.
moc3071m, moc3072m www. onsemi.com 7 figure 7 . basic driver circuit figure 8 . triac driver circuit for noisy environments figure 9 . triac driver circuit for extremely noisy environments figure 10 . minimum time for led turn off to zero crossing l o a d r l e d r t r i a c d r i v e r v c c c o n t r o l a c l i n e q p o w e r t r i a c r e t . t y p i c a l s n u b b e r v a l u e s r s = 3 3 w , c s = 0 . 0 1 f m o v ( m e t a l o x i d e v a r i s t o r ) p r o t e c t s p o w e r t r i a c a n d d r i v e r f r o m t r a n s i e n t o v e r v o l t a g e s > v d r m m a x m o v r s c s load r led r triac driver v cc control ac line q power triac ret . r led = ( v cc C v f led C v sat q ) / i ft r = v p ac / i tsm l o a d r l e d r t r i a c d r i v e r v c c c o n t r o l a c l i n e q p o w e r t r i a c r e t . r e c o m m e n d e d s n u b b e r t o p a s s i e e e 4 7 2 a n d i e c 2 5 5 - 4 n o i s e t e s t s r s = 4 7 w , c s = 0 . 0 1 f m o v r s c s 0 180 led pw led current led turn off min . 200 s ac line
moc3071m, moc3072m www. onsemi.com 8 reflow profile profile feature pb - free assembly profile temperature minimum (tsmin) 150c temperature maximum (tsmax) 200c time (t s ) from (tsmin to tsmax) 60 seconds to 120 seconds ramp - up rate (t l to t p ) 3c/second maximum liquidous temperature (t l ) 217c time (t l ) maintained above (t l ) 60 seconds to 150 seconds peak body package temperature 260c +0c / C 5c time (t p ) within 5c of 260c 30 seconds ramp - down rate (t p to t l ) 6c/second maximum time 25c to peak temperature 8 minutes maximum f igure 11 . reflow profile
moc3071m, moc3072m www. onsemi.com 9 ordering information (note 5 ) device package shipping moc3071m dip 6 - pin tube (50 units) moc3071sm smt 6 - pin (lead bend) tube (50 units) moc3071sr2m smt 6 - pin (lead bend) tape and reel (1000 units) moc3071vm dip 6 - pin, din en/iec60747 - 5 - 5 option (pending approval) tube (50 units) moc3071svm smt 6 - pin (lead bend), din en/iec60747 - 5 - 5 option (pending approval) tube (50 units) MOC3071SR2VM smt 6 - pin (lead bend), din en/iec60747 - 5 - 5 option (pending approval) tape and reel (1000 units) moc3071tvm dip 6 - pin, 0.4 lead spacing, din en/iec60747 - 5 - 5 option (pending approval) tube (50 units) 5. the product orderable part number system listed in this table also applies to the moc3072m product families.
moc3071m, moc3072m www. onsemi.com 10 packaging dimensions 6 l ea d mdip opto white 0. 3" wide notes: a) no standard applies to this package. b) all dimensions are in millimeters. c) dimensions are exclusive of burrs, mold flash, and tie bar extrusion 5.08 (max) 8.13-8.89 0.38 (min) 3.28-3.53 0.41-0.51 1.02-1.78 0.76-1.14 0.25-0.36 6.10-6.60 2.54 bsc 2.54-3.81 pin 1 d) drawing filename and revsion: mkt-n06brev4. 1 3 6 4 (0.86) 6.60 8.89 0.20-0.30 7.62 (typ) 15.0 (typ)
moc3071m, moc3072m www. onsemi.com 11 6 - l ea d mdip opto white su rface mount form notes: a) no standard applies to this package. b) all dimensions are in millimeters. c) dimensions are exclusive of burrs, mold flash, and tie bar extrusion land pattern recommendation 8.13-8.89 (7.49) (10.54) (1.78) (0.76) (1.52) 6.10-6.60 8.43-9.90 3.28-3.53 5.08 (max) 0.38 (min) 0.25-0.36 0.41-0.50 1.02-1.78 2.54 (bsc) (2.54) 0.20-0.30 0.16-0.88 pin 1 d) drawing filename and revsion : mkt-n06crev4. 0.76-1.14 (8.13) 1 3 6 4 (0.86) 2.49 1.89
moc3071m, moc3072m www. onsemi.com 12 6 l ea d mdip opto white 0. 4" lead spacing notes: a) no standard applies to this package. b) all dimensions are in millimeters. c) dimensions are exclusive of burrs, mold flash, and tie bar extrusion 5.08 (max) 8.13-8.89 0.38 (min) 3.28-3.53 0.41-0.51 1.02-1.78 0.76-1.14 0.25-0.36 6.10-6.60 2.54 bsc 2.54-3.81 10.16-10.80 0.20-0.30 pin 1 d) drawing filename and revsion: mkt-n06drev4 1 3 6 4 (0.86)
moc3071m, moc3072m on semiconductor and the on semiconductor logo are trademarks of semiconductor components industries, llc dba on semiconducto r or its subsidiaries in the united states and/or other countries. on semiconductor owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property. a listing of on semiconductors product/patent coverage may be accessed at www.onsemi.com/site/pdf/patent - marking.pdf. on semiconductor reserves the right to make changes without furth er notice to any products herein. on semiconductor makes no warranty, representation or guarantee regarding the suitability of i ts products for any particular purpose, nor does on semiconductor assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. buyer is responsible for its products and applications using on semiconductor products, including complianc e with all laws, regulations and safety requirements or standards, regardless of any support or applications information provided by on semiconductor. typical parameters which may be provided in on semiconductor data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. all operating parameters, including typicals must be validated for each customer applicatio n by customers technical experts. on semiconductor does not convey any license under its patent rights nor the rights of others. on semiconductor products are not designed, intended, or authorized for use as a critical component in life support systems or any fda class 3 medical devices or medical devices with a same or similar classifica tion in a foreign jurisdiction or any devices intended for implantation in the human body. should buyer purchase or use on semiconductor products for any such unintended or unauthorized application, b uyer shall indemnify and hold on semiconductor and its o fficers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such uninte nded or unauthorized use, even if such claim alleges that on semiconductor was negligent regarding the design or manufacture of the part. on semiconductor is an equal opportunity/affirmative action employ er. this literature is subject to all applicable cop yright laws and is not for resale in any manner. publication ordering information literature fulfillment: literature distribution center for on semiconductor 19521 e. 32nd pkwy, aurora, colorado 80011 usa phone : 303 - 675 - 2175 or 800 - 344 - 3860 toll free usa/canada fax: 303 - 675 - 2176 or 800 - 344 - 3867 toll free usa/canada email : orderlit@onsemi.com n. american technical support : 800 - 282 - 9855 toll free usa/canada. europe, middle east and africa technical support : phone: 421 33 790 2910 japan customer focu s center phone: 81 - 3 - 5817 - 1050 on semiconductor website : www.onsemi.com order literature : http://www.onsemi.com/orderlit for additional information, please contact your local sales representative
www. onsemi.com 1 on semiconductor and are trademarks of semiconductor components industries, llc dba on semiconductor or its subsidiaries i n the united states and/or other countries. on semiconductor owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property . a listing of on semiconductor?s product/patent coverage may be accessed at www.onsemi.com/site/pdf/patent ? marking.pdf . on semiconductor reserves the right to make changes without further notice to any products herein. on semiconductor makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does o n semiconductor assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including wi thout limitation special, consequential or incidental damages. buyer is responsible for its products and applications using on semiconductor products, including compliance with all laws, reg ulations and safety requirements or standards, regardless of any support or applications information provided by on semiconductor. ?typical? parameters which may be provided in on semiconductor data sheets and/or specifications can and do vary in dif ferent applications and actual performance may vary over time. all operating parameters, including ?typic als? must be validated for each customer application by customer?s technical experts. on semiconductor does not convey any license under its patent rights nor the right s of others. on semiconductor products are not designed, intended, or authorized for use as a critical component in life support systems or any fda class 3 medical devices or medical devices with a same or similar classification in a foreign jurisdiction or any devices intended for implantation in the human body. should buyer purchase or use on semicondu ctor products for any such unintended or unauthorized application, buyer shall indemnify and hold on semiconductor and its officers, employees, subsidiaries, affiliates, and distrib utors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that on semiconductor was negligent regarding the design or manufacture of the part. on semiconductor is an equal opportunity/affirmative action employer. this literature is subject to all applicable copyright laws and is not for resale in any manner. publication ordering information n. american technical support : 800 ? 282 ? 9855 toll free usa/canada europe, middle east and africa technical support: phone: 421 33 790 2910 japan customer focus center phone: 81 ? 3 ? 5817 ? 1050 www.onsemi.com literature fulfillment : literature distribution center for on semiconductor 19521 e. 32nd pkwy, aurora, colorado 80011 usa phone : 303 ? 675 ? 2175 or 800 ? 344 ? 3860 toll free usa/canada fax : 303 ? 675 ? 2176 or 800 ? 344 ? 3867 toll free usa/canada email : orderlit@onsemi.com on semiconductor website : www.onsemi.com order literature : http://www.onsemi.com/orderlit for additional information, please contact your local sales representative ? semiconductor components industries, llc

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